RF plasma allows the low-temperature modification of a wide range of specimens and substrates. Plasma etching is generally confined to the semiconductor industry, typically for the removal of silicon layers using reactive gases, such as CF4 and for the removal of Photoresist using oxygen.
Plasma ashing refers to the controlled, low-temperature removal of organic material using oxygen or air and has applications across many areas of research and quality control. RF plasma can also be used for the surface modification of plastics and polymers, and for cleaning TEM and SEM specimens and specimen holders.
The K1050X Plasma Etcher/Asher/Cleaner is a compact, bench-top system designed for research and development, and some small scale production applications.
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