Quorum offers a range of products to support the laboratory workflow for sample preparation. If you were unable to see what you are looking for, please don’t hesitate to contact us and one of our applications support team will be available to guide you.
The Quorum QuickLok provides an efficient and rapid way of transferring ambient temperature EM specimens – either under vacuum or in inert gas – into the vacuum chamber of SEM, FIB/SEM, beamline and other vacuum systems.
A key feature of the QuickLok is the ability to vacuum transfer specimens that are sensitive to normal environmental conditions. The transfer device includes a sealed vacuum chamber which can be interfaced to a glove box for inert gas transfer or vacuum transfer from a wide range of instruments.
The Quorum K1050X RF plasma barrel reactor is designed for plasma etching, plasma ashing and plasma cleaning applications.
RF plasma allows the low-temperature modification of a wide range of specimens and substrates. Plasma etching is generally confined to the semiconductor industry, were the Quorum K1050X can be used to remove silicon layers using reactive gases, such as CF4 and for the removal of photoresist using oxygen.
Plasma ashing refers to the controlled, low-temperature removal of organic material using oxygen or air and has applications across many areas of research and quality control. RF plasma can also be used for the surface modification of plastics and polymers – and for cleaning TEM and SEM specimens and specimen holders.
The K1050X is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications.
Thermal evaporation under high vacuum is an established method of depositing thin layers of metals and carbon. Typical applications include the production of support films and specimen replicas for transmission electron microscopy (TEM) and many thin-film applications.
The K975X Turbo-Pumped Thermal Evaporator is a large chamber system with comes as standard with a carbon rod gun and a metal filament/boat source.
Based on the successful Q Series of sputter/carbon coaters, the Q300T ES
is a large chamber, turbomolecular-pumped coating system ideally suited to metal evaporation onto large diameter specimens or smaller multiple specimens. The Q300T ES also comes with interchangeable sputtering and carbon evaporation inserts.
The K975X is a compact, bench-mounted, multiple application thermal evaporator for vacuum deposition of thin layers of carbon and metals. It is ideal for a wide range of techniques, including the production of carbon support films and replicas for TEM and carbon/metal thin film applications. The K975X is available with a wide range of optional add-ons, including low-angle shadowing and sequential layer coating using dual-source evaporation (an additional metal evaporation source is required). K975S Carbon Evaporator for 8” wafers. The K975S is similar to the K975X, but designed to coat an 8” wafer or similarly large specimen with carbon.
The E4800 Series of Recirculating Heaters/Chillers are recommended for a wide range of open and closed-loop temperature control applications.
The E4800 Series of Recirculating Heaters/Chillers are recommended for a wide range of open and closed-loop temperature control applications. The E4860 is an option for the E3100 and K850MW critical point dryers. For applications requiring heating only, the E3500 Thermocirculator is recommended.