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RF Plasma Etchers / Plasma Reactors

RF plasma allows the low-temperature modification of a wide range of specimens and substrates. Plasma etching is generally confined to the semiconductor industry, typically for the removal of silicon layers using reactive gases, such as CF4 and for the removal of photoresist using oxygen. 

Plasma ashing refers to the controlled, low-temperature removal of organic material using oxygen or air and has applications across many areas of research and quality control. RF plasma can also be used for the surface modification of plastics and polymers, and for cleaning TEM and SEM specimens and specimen holders.

If you would like to talk to a member of our sales team in the UK about any products, please call us on:+44 (0)1323 810981 or email

K1050X RF Plasma Etcher/Asher/Cleaner

The K1050X is a modern, solid-state RF plasma barrel reactor designed to meet the requirements of research and development and small-scale production for a wide and varied range of plasma etching, plasma ashing and plasma cleaning applications.

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