Sputter and Carbon Coaters

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    Q300T D Plus – dual target sequential sputtering for specimens up to 150 mm diameter

    Suitable for multi-layer sequential sputtering of two materials, the Q300T D Plus has two independent sputtering heads, which allows sequential sputtering of two metals without the need to break vacuum. The system is fully automated with user defined recipes controlling the pumping sequence, time, number of sputter cycles, and the current used during the process. Unlimited layers of varying thickness from two target materials can be sputtered sequentially by cycling between both targets.  When not in use the targets are shuttered for protection from contamination.

    Key features

    • Capable of achieving vacuum of 5 x 10-5 mbar
    • New touch and swipe capacitive screen
    • USB port for upgrades and download of process log files
    • Multiple-user profiles can be set up on one machine
    • New software sorts recipes per user according to recent use
    • 16GB of memory can store more than 1000 recipes
    • New multi-colour LED visual status indicator
    • Interchangeable stage options
    • Two sputter heads for large area deposition of different materials
    • Single head selection for small samples

    Click to download the product brochure

    • Product Description
    • Images
    • Ordering information
    • Additional Information
    • Downloads & Specifications

    Substrates can be coated using non-oxidising (noble) metals such as gold (Au) and platinum (Pt). For coatings with a fine grain structure iridium (Ir) can also be used. With the high-quality vacuum system the Q300T D Plus is also capable of using oxidising metal targets such as chromium (Cr) and aluminium (Al) to produce fine films and coatings. The Q300T D Plus comes as standard with a chromium (Cr) target and gold (Au) target

    Recommended applications for the Q300T D Plus:

    • Ideal for multi-layer coating
    • Adhesion studies
    These products are for Research Use Only. 

    New user interface has been thoroughly updated:

    • Dual-core ARM processor for a fast, responsive display
    • Capacitive touch screen is more sensitive for ease of use
    • User interface software has been extensively revised, using a modern smartphone-style interface
    • Comprehensive context-sensitive help
    • USB interface allows easy software updates and backing up/copying of recipe files to USB stick
    • Process log files can be exported via USB port in .csv format for analysis in Excel or similar.  Log files include date, time and process parameters.
    • 16GB of flash memory can store more than
    1000 recipes
    • Quick and easy creation of process sequences with a simple copy, drag and drop operation
    Allows multiple users to input and store coating recipes. New feature to sort recipes per user according to recent use.
    System prompts user to confirm target material and it then automatically selects appropriate parameters for that material
    Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating profiles are already stored but also allows the user to create their own.
    Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.

    Detachable chamber with built-in implosion guard

    Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process.
    Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples.
    Tall chamber option is available for improved uniformity for sputtering and to hold larger substrates.

    Dual head sputtering – for sequential sputtering

    The Q300T D Plus has two independent sputtering heads to allow sequential sputtering of two different metals without the need to ‘break’ vacuum, for example, a thin ‘seeding’ layer of chromium (Cr) followed by deposition of gold (Au). An automatic shutter mechanism enables cleaning of oxidising sputter targets and protects the second target and substrate during coatings. For single metal applications one target can be selected.

    Multiple stage options

    The Q300T D has substrate stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except the rotary planetary stage). A swinging arm stage drive is supplied as standard, which is a stage drive and positioning mechanism that positions the stage under the correct target. Rotation speed is variable between 14-38 rpm:
    In addition a flat, adjustable stage capable of accepting 4” (101.6 mm) wafers is supplied as standard with the Q300T D Plus.
    As an accessory, a 6” wafer stage is available, which is a flat adjustable stage capable of accepting 6” or 150 mm wafers. The stage includes two masks for improving uniformity of coating.
    Rotation stage – 50 mm Ø. This stage only rotates and has no tilt or height adjustment.
    Rotate-tilt stage – 50 mm Ø. With height adjustment (target to stage height variable between 30-80 mm). The tilt angle can be pre-set (horizontal to 30°).
    Rotation stage for glass slides – 25mm x 76mm


    The Q300T D Plus meets key industry CE standards
    • All electronic components are protected by covers
    • Implosion guard prevents user injury in event of chamber failure
    • Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened
    • Overheating protection shuts down power supply

    Vacuum control

    High vacuum turbo pumping allows sputtering of a wide range of oxidising and non-oxidising metals for thin film and electron microscopy applications. Automatic vacuum control which can be pre-programmed to suit the process and material, therefore removing the need for manual intervention or control.

    Cool magnetron sputtering

    Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation.  However, this is not suitable for some applications because it can heat the substrate and result in damage when the plasma interacts with the substrate. The Q series uses low temperature enhanced-plasma magnetrons optimised for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your substrate is protected and uniformly coated.
    The Q300T D Plus uses easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidising and noble metals. It is fitted with gold (Au) and chromium (Cr) sputter targets as standard.

    Pulsed cleaning for aluminium sputtering

    Aluminium (Al) rapidly forms an oxide layer which can be difficult to remove. The Q300T D Plus has a special recipe for aluminium that reduces the oxide removal time and prevents excessive pre-sputtering of the target.

    Film thickness monitor

    The Q300T D Plus can be fitted with an optional dual film thickness monitor (FTM), which measures the coating thickness on two quartz crystal monitors located within the chamber. The thickness measured on the monitor can be correlated to the thickness on the substrate using a mathematical formula built into the software; this allows the user to control the thickness of material deposited on to the substrate. For example, the Q300T D Plus can automatically terminate a coating profile when the required thickness has been achieved. Alternatively, the process can be terminated by time.

    No. Q300TDPLUS
    Q300T D Plus Dual Target Sequential Sputtering System

    Includes a 57 mm Ø x 0.5 mm chromium (Cr) target (TK8845) and a 57 mm Ø x 0.1 mm thick gold (Au) target (SC502-314A). A flat rotation stage for 4″/100 mm wafers is included.

    Rotary pump requirements

    13034. 5 m3/hr Pfeiffer DUO 6 two-stage rotary vacuum pump. Includes vacuum hose, coupling kit and oil mist filter.

    Dry pumping options:

    11540. Diaphragm pump. A ‘dry’ alternative to the standard 13034 oil-based rotary pump, complete with vacuum hose, coupling kit and oil mist filter.

    26907. Edwards dry scroll pump nXDS10i. Pumping speed: 11.4 m/3hr.

    Options and accessories

    10357. Rotating 50 mm Ø specimen stage with adjustable tilt. The platform has six specimen stub positions for 15 mm, 10 mm, 6.5 mm or 1/8″ pin stubs. Stage rotation speed is variable between preset limits.

    NB: Target to stage height is variable between 0-42 mm for the standard stage. When used with the extended height cylinder (optional accessory 10596) the target to stage height is an additional 87 mm.

    10067. 50 mm Ø variable height specimen stage. Has six stub positions for 15 mm, 10 mm, 6.5 mm disc stubs.

    10360. 50 mm Ø “Rotacota” stage. A rotary planetary-style stage with variable tilt angle from horizontal to 30º. The platform has six positions for either 15 mm, 10 mm, 6.5 mm disc stubs or 1/8″ pin stubs. Rotation speed is variable between preset limits.

    Note: Depending on specimen height, this stage may require the optional extended height cylinder.

    10358. 90 mm Ø specimen stage for glass microscope slides. For up to two  75 mm x 25 mm slides or a single 75 mm x 50 mm slide). The stage can alternatively accommodate up to six 1/8″ SEM pin stubs. The stage rotation speed is variable between preset limits and includes a gear box to allow the optional FTM to be used.

    10779. Dual channel film thickness monitor (FTM). A fully integrated system using the Q300T D touch screen display for the control and display of all FTM functions. Allows automatic termination of the sputtering process at pre-selected thickness values. Displays rate for sputtering processes in nm/m, with a resolution of 0.1 nm. Two FTM crystal holders are fixed in the chamber to give optimal position for both targets and to coat one material per crystal. Includes two spare C5460 quartz crystals

    C5460. Spare quartz crystal.

    10596. Extended height vacuum chamber. (214 mm H – the standard chamber is 127mm H). Recommended for increased source-to-specimen distance and for coating large specimens.

    10422. Rotating vacuum spigot.  Allows a more convenient connection of the vacuum pump hose to the rear of the coater for when bench depth is limited.

    11223. Lockable emergency stop (e-stop) switch. This can be mounted on top of the system in a position easily accessible for the operator. It is provided with a key to release the knob after activation. NB: The addition of the e-stop does not inhibit or replace the normal on/off switch function.

    11576. Coating shields. Can be fitted to protect large surfaces from coating deposition – easily removable for ease of cleaning.

    10428. Full range, active vacuum gauge. Capable of measurement over the range of 1,000 mbar to 5 x 10-9 mbar. Typical ultimate vacuum of system is 5 x 10-5mbar. Must be factory fitted.

    11288. Spares Kit. Includes one TK8845 chromium target, one SC502-314A 57 mm Ø x 0.1 mm gold (Au) sputter target, standard glass cylinder assembly (10595), C5460 quartz crystals and fuses.

    Sputter targets

    Note: The Q300T D Plus is fitted as standard with a 57 mm Ø x 0.3 mm chromium (Cr) target (TK8845) and 57 mm Ø x 0.1 mm gold (Au) target (SC502-314A). All targets are 57 mm in diameter but thicknesses vary:

    TK9000. Aluminium (Al) 0.76 mm.

    TK8869. Carbon (C) 1.5 mm

    TK8845.Chromium (Cr) 0.5 mm

    TK8862. Chromium (Cr) 1.5 mm

    TK8900. Cobalt (Co) 0.1 mm

    TK8870. Copper (Cu) 0.1 mm

    TK8889. Gold (Au) 0.3 mm

    TK8859.Gold (Au) 0.1 mm

    TK8860. Gold/palladium (Au/Pd) 0.1 mm

    TK8891. Gold/palladium (Au/Pd) (60:40) 0.3 mm

    TK8907. Indium tin oxide (ITO) Ø x 3 mm

    TK8899. Iridium (Ir) 0.2 mm

    TK8897. Iron (Fe) 0.1 mm

    TK8905. Magnesium (Mg) 0.3 mm

    TK8903. Molybdenum (Mo) 0.1 mm

    TK8872. Nickel (Ni) 0.1 mm

    TK8877. Palladium (Pd) 0.1 mm

    TK8861. Platinum (Pt) 0.1 mm

    TK8893. Platinum (Pt) 0.3mm

    TK8878. Platinum/palladium (Pt/Pd) (80:20) 0.1 mm

    TK8887. Platinum/palladium (Pt/Pd) (80:20) 0.3 mm

    TK8871. Silver (Ag) 0.1 mm

    TK8906. Tantalum (Ta) 0.1 mm

    TK8902.Tin (Sn) 0.1 mm

    TK8879. Titanium (Ti) 1.5 mm

    TK8895. Titanium (Ti) 0.5 mm

    TK8846. Tungsten (W) 0.5 mm

    TK8867. Tungsten 0.2 mm

    Instrument case

    590 mm W x 535 mm D x 420 mm H (maximum height during the opening of the coating head: 772 mm)


    36 kg (packed: 59 kg)

    Packed dimensions

    730 mm W x 630 mm D x 690 mm H

    Work chamber

    Borosilicate glass with integral PET implosion guard Size 300 mm outside diameter x 127 mm High


    115.5mm W x 86.4mm H (active area), 640 RGB x 480 (display format), capacitive touch colour display

    User interface

    Full graphical interface with touch screen buttons, includes features such as a log of the last 1000 coatings and reminders for when maintenance is due

    Specimen stage

    A flat adjustable stage capable of accepting either 4” or 6” wafers is mounted on a swinging arm stage, which rotates the stage under the targets to optimise coating.  Rotation speed is variable from 14rpm to 38rpm


    Rotary pump:  Rotary pump – 50L/min two stage rotary  pump with oil mist filter
    Turbo pump: Turbo pump – internally mounted 70L/sec air cooled
    Vacuum Measurement: Pirani gauge as standard, full range gauge  available as an option
    Ultimate vacuum: 5 x 10-5 mbar*
    Sputter vacuum range: 5 x 10-3 to 5 x 10-2 mbar*


    Sputter Deposition Current: 150 mA
    *Typical ultimate vacuum of the pumping system in a clean instrument after pre-pumping and venting with dry nitrogen gas

    Visual status indicator

    A large multi-colour status indicator light provides a visual indication of the state of the equipment, allowing users to easily identify the status of a process at a distance.
    The indicator LED shows the following states:
    • Initialisation
    • Process running
    • Idle
    • Coating in progress
    • Process completed
    • Process ended in fault condition
    Audio indication also sounds on completion of the process.


    Gases: process gas argon, 99.999% Nominal 5psi

    Vent gas

    Nitrogen (optional). Nominal 5psi



    Judges House, Lewes Road,
    Laughton, East Sussex.
    BN8 6BN

    +44 1323 810981


    [email protected]


    Working Hours

    8.30 – 5.00 pm Mon – Thu
    8.30 – 4.00 pm Fri

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