Send me a Q300T D quote

Q300T D Dual Target Sequential Sputtering System

The Q300T D is a fully automatic, large chamber, dual-head sputter coater ideally suited for thin film applications and for conductive coating of scanning electron microscopy (SEM) specimens. The dual-head configuration allows two different oxidising or non-oxidising metals to be sequentially sputtered without the need to 'break' vacuum. A dual channel film thickness monitor option is available.
Key features
  • Fully automatic touch screen control - rapid data input, simple operation
  • Dual sputter head - for sequential sputtering of two different metals, ideal for many thin film applications
  • A wide range of oxidising and non-oxidising targets are available
  • Large chamber format
  • Optional dual channel film thickness monitor (FTM) module
  • Vacuum shut-down feature - leaves the process chamber under vacuum when not in use - improved vacuum performance
  • Thick film capabilities - up to 60 minutes sputtering time without breaking vacuum
  • Extended warranty option
Click to download Brochure

Ideal for sputter coating of large specimens, thin film applications and SEM specimen coating

The Q300T D is designed for sequentially sputtering a range of oxidising and non-oxidising (noble) metals for scanning electron microscopy (SEM) and thin film applications. A key feature of the Q300T D is its ability to deposit two materials (up to five layers) without the need to break vacuum. For details of available target materials see: Ordering Information. 

The Q300T D comes as standard with a chromium (Cr) target and gold (Au) target.


High-vacuum turbomolecular pumping

The Q300T D is fitted with an internally mounted 70 L/s turbomolecular pump, backed by a 50 L/m two-stage rotary pump (order separately). A Pirani vacuum measurement gauge (range: 1,000 mbar to 5 x 10-4 mbar) is included, but a full range gauge is available as an option. Typical ultimate vacuum levels of around 5 x 10-5mbar can be expected in a clean system after pre-pumping with dry nitrogen gas.


Dual head sputtering - for sequential sputtering

The Q300T D has two independent sputtering heads to allow sequential sputtering of two different metals without the need to ‘break’ vacuum, for example, a thin ‘seeding’ layer of chromium (Cr) followed by deposition of gold (Au). An automatic shutter mechanism enables cleaning of oxidising sputter targets and protects the second target and substrate during coatings. For single metal applications one target can be selected.


Specimen stages

The Q300T D is fitted with a flat rotating specimen stage capable of accepting wafers up to 4"/100 mm in diameter. The rotation speed is variable between preset limits and the stage to sputtering head distance can be adjusted between 25-71 mm. A range of optional specimen stages can be fitted - see: Ordering Information.


Moulded case with colour touch screen

The Q300T D is presented in a custom moulded, one-piece case, allowing easy servicing access. The colour touch screen allows multiple users to input and store coating ‘recipes’. The case houses all the working components and includes an automatic bleed control that ensures optimum vacuum conditions during sputtering.

The vacuum chamber has an internal diameter of 283 mm/12” and comes with an integral implosion guard. A useful feature of the Q300T D is ‘vacuum shutdown’, which enhances vacuum performance by allowing the chamber vacuum to be maintained when the system is not in use.


Rapid data entry

At the operational heart of the Q300T D is a colour touch screen, which allows inexperienced or occasional operators to rapidly enter and store their own process data. For added convenience a number of typical sputter coating profiles are already stored. 


Maintenance

The touch screen interface features maintenance prompts that highlight the time of last clean, coating time since last clean, system ‘on time’ and time of last service.

Pumping requirement

A suitable rotary vacuum pump is required. The Pfeiffer DUO 6  5 m3/hr two-stage rotary vacuum pump is ideal for this purpose. Dry pumping alternatives are also available. See: Ordering Information for more details.

10360. Q300T D Dual Target Sequential Sputtering System

Includes a 57 mm Ø x 0.3 mm chromium (Cr) target (TK8845) and a 57 mm Ø x 0.1 mm thick gold (Au) target (SC502-314A). A flat rotation stage for 4"/100 mm wafers is included.


Rotary pump requirements

13034. 5 m3/hr Pfeiffer DUO 6 two-stage rotary vacuum pump. Includes vacuum hose, coupling kit and oil mist filter.

Dry pumping options:

11540. Diaphragm pump. A 'dry' alternative to the standard 13034 oil-based rotary pump, complete with vacuum hose, coupling kit and oil mist filter.

26907. Edwards dry scroll pump nXDS10i. Pumping speed: 11.4 m/3hr.


Options and accessories

10357. Rotating 50 mm Ø specimen stage with adjustable tilt. The platform has six specimen stub positions for 15 mm, 10 mm, 6.5 mm or 1/8" pin stubs. Stage rotation speed is variable between preset limits. 

NB: Target to stage height is variable between 0-42 mm for the standard stage. When used with the extended height cylinder (optional accessory 10596) the target to stage height is an additional 87 mm.

10067. 50 mm Ø variable height specimen stage. Has six stub positions for 15 mm, 10 mm, 6.5 mm disc stubs.

10360. 50 mm Ø "Rotacota" stage. A rotary planetary-style stage with variable tilt angle from horizontal to 30º. The platform has six positions for either 15 mm, 10 mm, 6.5 mm disc stubs or 1/8" pin stubs. Rotation speed is variable between preset limits. 

Note: Depending on specimen height, this stage may require the optional extended height cylinder.

10358. 90 mm Ø specimen stage for glass microscope slides. For up to two  75 mm x 25 mm slides or a single 75 mm x 50 mm slide). The stage can alternatively accommodate up to six 1/8" SEM pin stubs. The stage rotation speed is variable between preset limits and includes a gear box to allow the optional FTM to be used.

10779. Dual channel film thickness monitor (FTM). A fully integrated system using the Q300T D touch screen display for the control and display of all FTM functions. Allows automatic termination of the sputtering process at pre-selected thickness values. Displays rate for sputtering processes in nm/m, with a resolution of 0.1 nm. Two FTM crystal holders are fixed in the chamber to give optimal position for both targets and to coat one material per crystal. Includes two spare C5460 quartz crystals

C5460. Spare quartz crystal.

10596. Extended height vacuum chamber. (214 mm H - the standard chamber is 127mm H). Recommended for increased source-to-specimen distance and for coating large specimens.

10422. Rotating vacuum spigot.  Allows a more convenient connection of the vacuum pump hose to the rear of the coater for when bench depth is limited.

11223. Lockable emergency stop (e-stop) switch. This can be mounted on top of the system in a position easily accessible for the operator. It is provided with a key to release the knob after activation. NB: The addition of the e-stop does not inhibit or replace the normal on/off switch function. 

11576. Coating shields. Can be fitted to protect large surfaces from coating deposition - easily removable for ease of cleaning.

10428. Full range, active vacuum gauge. Capable of measurement over the range of 1,000 mbar to 5 x 10-9 mbar. Typical ultimate vacuum of system is 5 x 10-5mbar. Must be factory fitted.

11288. Spares Kit. Includes one TK8845 chromium target, one SC502-314A 57 mm Ø x 0.1 mm gold (Au) sputter target, standard glass cylinder assembly (10595), C5460 quartz crystals and fuses.


Sputter targets

Note: The Q300T D is fitted as standard with a 57 mm Ø x 0.3 mm chromium (Cr) target (TK8845) and 57 mm Ø x 0.1 mm gold (Au) target (SC502-314A). All targets are 57 mm in diameter but thicknesses vary:

TK9000. Aluminium (Al) 0.76 mm.

TK8869. Carbon (C) 1.5 mm/

TK8845.Chromium (Cr) 0.3 mm

TK8862. Chromium (Cr) 1.5 mm

TK8900. Cobalt (Co) 0.1 mm

TK8870. Copper (Cu) 0.1 mm

TK8889. Gold (Au) 0.3 mm

TK8859.Gold (Au) 0.1 mm

TK8860. Gold/palladium (Au/Pd) 0.1 mm

TK8891. Gold/palladium (Au/Pd) (60:40) 0.3 mm

TK8907. Indium tin oxide (ITO) Ø x 3 mm

TK8899. Iridium (Ir) 0.2 mm

TK8897. Iron (Fe) 0.1 mm

TK8905. Magnesium (Mg) 0.3 mm

TK8903. Molybdenum (Mo) 0.1 mm

TK8872. Nickel (Ni) 0.1 mm

TK8877. Palladium (Pd) 0.1 mm

TK8861. Platinum (Pt) 0.1 mm

TK8893. Platinum (Pt) 0.3mm

TK8878. Platinum/palladium (Pt/Pd) (80:20) 0.1 mm

TK8887. Platinum/palladium (Pt/Pd) (80:20) 0.3 mm

TK8871. Silver (Ag) 0.1 mm

TK8906. Tantalum (Ta) 0.1 mm

TK8902.Tin (Sn) 0.1 mm

TK8879. Titanium (Ti) 1.5 mm

TK8895. Titanium (Ti) 0.5 mm

TK8846. Tungsten (W) 0.5 mm

TK8867. Tungsten 0.2 mm

Specimen stages

The Q300T D has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except rotary planetary stage). Rotation speed is variable between 14-38 rpm:

Flat rotation stage for 4"/100 mm wafers - fitted as standard.

Flat rotation stage for 6"/150 mm wafers.

Rotation stage - 50 mm Ø. This stage only rotates and has no tilt or height adjustment.

Rotate-tilt stage - 50 mm Ø. With height adjustment (target to stage height variable between 30-80 mm). The tilt angle can be preset (horizontal to 30°).

Rotation stage for glass microscope slides.


Other options

Extended height chamber for taller specimens.

Dual-channel film thickness monitor (FTM). The optional FTM attachment (10779) consists of a controller and quartz crystal oscillator built into the Q300T D and a vacuum feed-through, two chamber-mounted crystal holders and quartz crystals.


Specifications

General

Instrument case. 585 mm W x 470 mm D x 410 mm H (total height with coating head open is 650 mm).

Weight. 36.6 kg.

Packed dimensions. 725 mm W x 660 mm D x 680 mm H (44.8 kg).

Work chamber. Borosilicate glass 283 mm ID x 127 mm H.

Safety shield. Integral polyethylene terephthalate (PET) cylinder.

Display. Size: 145 mm, resolution: 320 mm x 240 mm colour graphic thin film transistor (TFT)

User interface. Intuitive full graphical interface with touch screen buttons, includes features such as a log of the last 100 coatings carried out and reminders for when maintenance is due.

Sputter target. Disc style 57 mm Ø with thickness depending on the targets fitted. One 57 mm Ø x 0.3 mm thick chromium (Cr) target (TK8845) and one 57 mm Ø x 0.1 mm thick gold (Au) target (SC502-314A) fitted as standard.

Vacuum

High vacuum pumping by an internally-mounted, 70 L/s air-cooled turbomolecular pump.

Rotary pump. 5 m3hr two-stage rotary pump with oil mist filter (order separately - 13034).

Vacuum measurement. Built-in Pirani gauge.

Typical ultimate vacuum. 5 x 10-5mbar in a clean system after pre-pumping with dry nitrogen gas.

Specimen stage

Flat rotation stage for 200 mm/8" and 150 mm/6" wafers fitted as standard. Rotation speed is variable between preset limits. For alternative stages see: Ordering Information.

Processes

Sputtering. 0-80 mA to a predetermined thickness (with optional FTM) or by the built-in timer. The maximum sputtering time is 60 minutes (without 'breaking' vacuum and with built-in rest periods).


Services and other information

Gases. Argon sputtering process gas, 99.999%. Nitrogen venting gas (optional).

Electrical supply. 90-250 V 50/60 Hz 1,400 VA including 13034 rotary pump.


Conformity

Power factor correction. Complies with the current legislation (CE Certification) and ensures efficient use of power, resulting in reduced running costs.